Industry News
IBM to Test Wafer Pruning
According to the Semiconductor Research Corp., a new wafer pruning technique could save 15 percent in semiconductor chip manufacturing costs and increase profits per chip by as much as 12 percent. The new wafer pruning technique is currently being characterized by IBM Corp. for its 45-nanometer process, using on-wafer monitoring structures that can be probed during fabrication to spot bad wafers early-on.